HV256 Datasheet Summary:

️· Device Type: High-Voltage Integrated Circuit (likely a driver or amplifier for high-voltage applications – specifics are not detailed in this excerpt).
️· Key Features (based on pad names):
- Multiple High-Voltage Output Channels (HVOUT0-31 – 32 outputs).
- Multiple High-Voltage Input Channels (VIN0-31 – 32 inputs).
- Power Supply Connections: VDD, VNN, GND.
- Bypass Capacitors Connections: BYP-VDD, BYP-VNN, BYP-VPP.
- Additional Connections: VPP, RSINK, RSOURCE, CATHODE, ANODE.
️· Package & Dimensions:
- Chip Size: 17160μm x 5830μm
- Die center is (0,0)
️· Pad Coordinates: A detailed table provides the X and Y coordinates (in microns) for all the pads on the chip. This is crucial for PCB layout and wire bonding.
️· Manufacturer: Supertex Inc. (www.supertex.com).

In essence, this datasheet provides the physical layout information and pin assignments necessary to integrate the HV256 chip into a circuit board. It does *not* include electrical characteristics, application information, or functional details. It’s a *physical* datasheet focusing on the mechanical aspects of connecting to the chip.