| Producent | Numer części | Arkusz danych | Szczegółowy opis |
Molex Electronics Ltd.
|
0878073001 |
252Kb/5P |
5.08mm (.200) Pitch and Multi-Centers Power, 2.54mm (.100) Pitch Signal, EXTreme PowerPlus??S-P(B) Header, Through Hole, Right Angle, Beveled Metal Pins |
| 0877590874 |
432Kb/8P |
2.00mm (.079 (15關 Cap, Tape and Reel Packaging, Lead-free |
| 0877594275 |
292Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 42 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging |
| 0877593074 |
432Kb/8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 30 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging |
| 0877593674 |
432Kb/8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 36 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging |
| 0877592875 |
292Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 28 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging |
| 0877591874 |
432Kb/8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 18 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging |
| 0877591674 |
432Kb/8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 16 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging |
| 0877594875 |
292Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 48 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging |
| 0877593675 |
292Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 36 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging |
| 0877591075 |
292Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 10 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging |
| 0877594074 |
431Kb/8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 40 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging |
| 0877592474 |
432Kb/8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 24 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging |
| 0877594274 |
432Kb/8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 42 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging |
| 0877592674 |
432Kb/8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 26 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging |
| 0877592074 |
432Kb/8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 20 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging |
| 0877593874 |
432Kb/8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 38 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging |
| 0877594874 |
432Kb/8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 48 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging |
| 0877591274 |
432Kb/8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 12 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging |
| 0877592275 |
292Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 22 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging |
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