| Producent | Numer części | Arkusz danych | Szczegółowy opis |

OSRAM GmbH
|
SFH4645EN |
496Kb/13P |
Infrared Illumination for cameras |
| BP104SR |
434Kb/13P |
Suitable for reflow soldering |
| SFH2200FA |
604Kb/13P |
Suitable for reflow soldering |
| LEUWD1W301-7N7P-GMKM-T01 |
888Kb/20P |
compact lightsource in multi chip on board technology with glass window on top |
| LEUWD1W501-7P8Q-GMKM-T01 |
929Kb/20P |
compact lightsource in multi chip on board technology with glass window on top |
| LE-UW-D1W4-01 |
533Kb/18P |
compact lightsource in multi chip on board technology with glass window on top |
| LE-A-H3W |
447Kb/19P |
compact lightsource in multi chip on board technology with glass window on top |
| LE-A-G3W |
576Kb/19P |
compact lightsource in multi chip on board technology with glass window on top |
| LEUWD1W201-7M7N-GMKM-T01 |
918Kb/20P |
compact lightsource in multi chip on board technology with glass window on top |
| LEUWD1W401-5P6Q-GMKM-T01 |
926Kb/20P |
compact lightsource in multi chip on board technology with glass window on top |
| LEUWD1W101-5L6M-GMKM-T01 |
906Kb/20P |
compact lightsource in multi chip on board technology with glass window on top |
| LE-UW-D1W5-01 |
520Kb/18P |
compact lightsource in multi chip on board technology with glass window on top |
| LEUWD1W101 |
294Kb/18P |
compact lightsource in multi chip on board technology with glass window on top |
| LE-UW-D1W1-01 |
294Kb/18P |
compact lightsource in multi chip on board technology with glass window on top |
| LE-UW-D1W2-01 |
605Kb/20P |
compact lightsource in multi chip on board technology with glass window on top |
| SFH4111 |
239Kb/7P |
For control and drive circuits |
| FO141 |
76Kb/1P |
Upgrades For Popular Projjecttiion Lamps |
| LEDRIVINGFOGT |
111Kb/3P |
Additional mounting for LEDriving FOG |
| LMWG5AP-7C8D-NZN7-DF-LH |
396Kb/17P |
slim package design for thin applications |
| Q65110A2120 |
435Kb/15P |
Nicht f체r Neuentwicklungen Not for new designs |