| Producent | Numer części | Arkusz danych | Szczegółowy opis |
Molex Electronics Ltd.
|
0877540552 |
194Kb/4P |
2.00mm (.079) Pitch Header, Breakaway, Right Angle, Through Hole, Vertical, 5 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray Packaging, Lead-free |
| 0850030309 |
84Kb/3P |
2.54mm (.100") Pitch DIN 41612 Header, Style C, Right Angle, Through Hole, 0.6關m (24關") Selective Gold (Au), Board Lock , 64 Circuits |
| 0757840125 |
1Mb/14P |
0.80mm (.031") Pitch, iPass??I/O SMT Receptacle, Vertical, Internal Application, 36 Circuit, 0.38關m (15關") Gold (Au), Retention Shell, Universal Key |
| 0753417774 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073") Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關") Gold (Au) |
| 0753417646 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073") Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關") Gold (Au) |
| 0753414764 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073") Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關") Gold (Au) |
| 0781208013 |
499Kb/7P |
1.27mm (.050") Pitch Wire-to-Board Receptacle, Dual Row, Vertical, SMT, 0.25關m (10關") Gold (Au) Plating, without Kapton Tape, 80 Circuits |
| 0753437777 |
179Kb/3P |
1.85mm by 1.85mm (.073 by .073") Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 24 Circuits, 1.27關m (50關") Gold (Au) |
| 0753414674 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073") Pitch 4-Pair GbX짰 Backplane Connector System Power Module, 12 Circuits, 1.27關m (50關") Gold (Au) |
| 0753436777 |
317Kb/6P |
1.85mm by 1.85mm (.073 by .073") Pitch 5-Pair GbX짰 Backplane Connector System,Power Module, 48 Circuits, 1.3關m (50關") Gold (Au) |
| 0753417476 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073") Pitch 4-Pair GbX짰 Backplane Connector System,Power Module, 12 Circuits, 1.27關m (50關") Gold (Au |
| 0753416477 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073") Pitch 4-Pair GbX짰 Backplane Connector System,Power Module, 12 Circuits, 1.27關m (50關") Gold (Au) |
| 0850132036 |
278Kb/8P |
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse1關m (40關") Selective Gold (Au), 48 Circuits, Lead free |
| 0757830122 |
1Mb/14P |
0.80mm (.031") Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application36 Circuit, 0.76關m (30關") Gold (Au), SMT Shell, Left Key |
| 0753417474 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0753416474 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0791077056 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.76關m (30關) Gold (Au) Selective Plating |
| 0877583650 |
147Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 36 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free |
| 0753414447 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0791077005 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.38關m (15關) Gold (Au) Selective Plating |
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