| Producent | Numer części | Arkusz danych | Szczegółowy opis |
Molex Electronics Ltd.
|
0791081056 |
304Kb/6P |
2.00mm (.079") Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row ThroughHole, 0.76關m (30關") Gold (Au) Selective Plating, 14 Circuits, Leadfree |
| 0757840131 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Vertical, Internal Application, 36 Circuit, 0.38關m (15關) Gold (Au), Through Hole Shell, Dual Key |
| 0874272448 |
155Kb/4P |
4.20mm (.165) Mini-Fit Jr.??Header, Vertical, Nylon, without Flange, 24Circuits, 0.76關m (30關) Gold (Au) over Nickel (Ni) Plating, Glow Wire Compatible |
| 0872633295 |
367Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Bottom Entry, 0.76關m (30關) Gold (Au) Selective, 32 Circuits, with Pick-and- Place Cap |
| 0781521443 |
158Kb/3P |
0.80mm(.032) Pitch SODIMM Socket, Right Angle, SMT, 0.25關m (10關) Gold (Au) Plating, Mounted Height 5.2mm (.205), 3.3V Power Supply, with Pegs |
| 0877584216 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 42 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0877159009 |
628Kb/10P |
1.00mm (.039) Pitch, PCI Express* Connector, 36 Circuits, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.76關m (30關) Gold (Au) Plating |
| 0752372103 |
284Kb/3P |
1.85mm by 1.85mm (.073 by .073) Pitch 5-Pair GbX짰 Backplane Connector System, Left Guide Header, 100 Circuits, Gold (Au) 0.76關m (30關) |
| 0877583416 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 34 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0877156302 |
348Kb/6P |
1.00mm (.039) Pitch, PCI Express* Connector, 164 Circuits, Nylon 6/6 Glass-filled, Black Housing, Phosphor Bronze, 0.38關m (15關) Gold (Au) Plating |
| 0850159008 |
178Kb/5P |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Press-fit Style R, 0.6關m (24關) Selective Gold (Au), 128 Circuits, Lead Free |
| 0877590864 |
432Kb/8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 8 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, without Press-fit Plastic Pegs |
| 0749790903 |
423Kb/4P |
2.00mm (.079) Pitch 6-Row VHDM-HSD??Backplane Header, Open Module, 36 Circuits, Gold (Au) Selective 0.76關m (30關), Pin Length 4.25mm (.167) |
| 0757840130 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Vertical, Internal Application, 36 Circuit, 0.38關m (15關) Gold (Au), Through Hole Shell, Right Key |
| 0749791003 |
421Kb/4P |
2.00mm (.079) Pitch 6-Row VHDM-HSD??Backplane Header, Open Module, 40 Circuits, Gold (Au) Selective 0.76關m (30關"), Pin Length 4.25mm (.167) |
| 0877584616 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 46 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0877584017 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 40 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0757840133 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Vertical, Internal Application, 36 Circuit, 0.76關m (30關) Gold (Au), Through Hole Shell, Left Key |
| 0757830111 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application, 36 Circuit, 0.38關m (15關) Gold (Au), SMT Shell, Right Key |
| 0850132127 |
170Kb/6P |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse, 1關m (40關) Selective Gold (Au), 48 Circuits, Lead free |
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