| Producent | Numer części | Arkusz danych | Szczegółowy opis |
Molex Electronics Ltd.
|
0873812018 |
126Kb/3P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.38關m (15關") Gold (Au) Plating, without Cap, with Locating Peg, 20 Circuits |
| 0877584217 |
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 42 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0877580817 |
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 8 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0877159121 |
347Kb/6P |
1.00mm (.039") Pitch, PCI Express* Connector, 64 Circuits, Nylon 4/6 Glass-filled, Blue Housing, Phosphor Bronze, 0.25關m (10關") Gold (Au) Plating |
| 0877580617 |
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 6 Circuits, 0.76關m(30關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0876313006 |
451Kb/6P |
2.00mm (.079") Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row ThroughHole, 0.76關m (30關") Gold (Au) Selective Plating, 32 Circuits, Leadfree |
| 0783940002 |
294Kb/6P |
0.80mm(.031"), 1.27mm(.050") Micro SAS Plug, Right Angle, Straddle Mount, 0.76關m(30關") Gold (Au) Plating, 25 Circuits, Halogen free, Lead free |
| 0877583817 |
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 38 Circuits, 0.76關m(30關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0877581417 |
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 14 Circuits, 0.76關m(30關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0877582417 |
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 24 Circuits, 0.76關m(30關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0791077269 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row1.91mm (.075") Tail Length, 0.76關m (30關") Gold (Au) Selective Plating, 40 CircuitsLeadfree |
| 0791077260 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row1.91mm (.075") Tail Length, 0.76關m (30關") Gold (Au) Selective Plating, 22 Circuits, |
| 0753310774 |
343Kb/6P |
1.85mm by 1.85mm (.073 by .073") Pitch 3-Pair GbX짰 Backplane Connector SystemPower Module, 6 Circuits, 1.27關m (50關") Gold (Au), Lead Free |
| 0877159111 |
347Kb/6P |
1.00mm (.039) Pitch, PCI Express* Connector, 64 Circuits, Nylon 4/6 Glass-filled, White Housing, Phosphor Bronze, 0.25關m (10關) Gold (Au) Plating |
| 0877580816 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 8 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0872632095 |
367Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Bottom Entry, 0.76關m (30關) Gold (Au) Selective, 20 Circuits, with Pick-and-Place Cap |
| 0877580616 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 6 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0877159112 |
347Kb/6P |
1.00mm (.039) Pitch, PCI Express* Connector, 64 Circuits, Nylon 4/6 Glass-filled, White Housing, Phosphor Bronze, 0.38關m (15關) Gold (Au) Plating |
| 0877159905 |
295Kb/4P |
1.00mm (.039) Pitch, PCI Express* Connector, 98 Circuits, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.38關m (15關) Gold (Au) Plating |
| 0877583816 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 38 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
Polish ▼ 
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Vietnamese
Indian
Mexican
British
New Zealand
