| Producent | Numer części | Arkusz danych | Szczegółowy opis |
Molex Electronics Ltd.
|
0877582017 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 20 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0757830109 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application, 36 Circuit, 0.38關m (15關) Gold (Au), Retention Shell, Dual Key |
| 0877159209 |
337Kb/6P |
1.00mm (.039) Pitch, PCI Express* Connector, 98 Circuits, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.76關m (30關) Gold (Au) Plating |
| 0781740800 |
260Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 8 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Press-fit Plastic Pegs |
| 0749792504 |
421Kb/4P |
2.00mm (.079) Pitch 6-Row VHDM-HSD??Backplane Header, Open Module, 100 Circuits, Gold (Au) Selective 0.76關m (30關), Pin Length 5.15mm (.203) |
| 0877583017 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 30 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0872631893 |
367Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Bottom Entry, 0.38關m (15關) Gold (Au) Selective, 18 Circuits, with Pick-and-Place Cap |
| 0877582817 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 28 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0749791006 |
421Kb/4P |
2.00mm (.079) Pitch 6-Row VHDM-HSD??Backplane Header, Open Module, 40 Circuits, Gold (Au) Selective 1.27關m (50關), Pin Length 4.75mm (.187) |
| 0877581416 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 14 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0877581216 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 12 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0757830108 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application, 36 Circuit, 0.38關m (15關) Gold (Au), Retention Shell, Right Key |
| 0877581617 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 16 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0780790011 |
820Kb/10P |
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.76關m (30關) Gold (Au) Plating |
| 0850159006 |
87Kb/3P |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Press-fit Style R+, 0.6關m (24關) Selective Gold (Au), 128 Circuits, Lead Free |
| 0873815000 |
327Kb/6P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.38關m (15關") Gold (Au) Plating, with Cap, without Locating Peg, 50 Circuits |
| 0877159306 |
628Kb/10P |
1.00mm (.039") Pitch, PCI Express* Connector, 164 Circuits, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.76關m (30關") Gold (Au) Plating |
| 0749791002 |
421Kb/4P |
2.00mm (.079") Pitch 6-Row VHDM-HSD??Backplane Header, Open Module, 40 Circuits, Gold (Au) Selective 0.76關m (30關"), Pin Length 6.25mm (.246") |
| 0791081061 |
304Kb/6P |
2.00mm (.079") Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row Through- Hole, 0.76關m (30關") Gold (Au) Selective Plating, 24 Circuits |
| 0877582217 |
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 22 Circuits, 0.76關m(30關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
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