| Producent | Numer części | Arkusz danych | Szczegółowy opis |
Molex Electronics Ltd.
|
0791077222 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row1.91mm (.075") Tail Length, 0.38關m (15關") Gold (Au) Selective Plating, 46 CircuitsLeadfree |
| 0757571382 |
177Kb/4P |
3.50mm (.138") Pitch, MX150??Header, Breakaway, Vertical, 16 Circuits, 0.75關m(30關") Select Gold (Au) Plating, 11.20mm (.441") Mating Pin Length, 4.75mm (.187") |
| 0791077062 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row3.00mm (.118) Tail Length, 0.76關m (30關") Gold (Au) Selective Plating, 26 Circuits, |
| 0791091254 |
1Mb/12P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Vertical, Top/Bottomwith Press-fit Plastic Pegs, without Cap, Tube, 0.76關m (30關") Gold (Au) |
| 0757830157 |
1Mb/14P |
0.80mm (.031") Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application36 Circuit, 0.76關m (30關") Gold (Au), Through Hole Shell, Left Key |
| 0877583216 |
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 32 Circuits, 0.38關m(15關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0783950001 |
328Kb/6P |
0.80mm(.031), 1.27mm(.050) Micro SAS Receptacle, Right Angle, SMT, 0.76關m (30關) Gold (Au) Plating, 25 Circuits, for 1.00mm (.039) PCB Thickness |
| 0877585017 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 50 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0780790012 |
820Kb/10P |
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.76關m (30關) Gold (Au) Plating |
| 0877156312 |
348Kb/6P |
1.00mm (.039) Pitch, PCI Express* Connector, 164 Circuits, Nylon 6/6 Glass-filled, White Housing, Phosphor Bronze, 0.38關m (15關) Gold (Au) Plating |
| 0749790909 |
421Kb/4P |
2.00mm (.079) Pitch 6-Row VHDM-HSD??Backplane Header, Open Module, 36 Circuits, Gold (Au) Selective 1.27關m (50關), Pin Length 5.15mm (.203) |
| 0877159900 |
143Kb/3P |
1.00mm (.039) Edgecard Connector, Vertical, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.38關m (15關) Gold (Au) Plating, with Plastic Pegs |
| 0877585016 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 50 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0877159402 |
348Kb/6P |
1.00mm (.039) Pitch, PCI Express* Connector, 36 Circuits, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.38關m (15關) Gold (Au) Plating |
| 0872631493 |
367Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Bottom Entry, 0.38關m (15關) Gold (Au) Selective, 14 Circuits, with Pick-and-Place Cap |
| 0877582016 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 20 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0749790902 |
423Kb/4P |
2.00mm (.079) Pitch 6-Row VHDM-HSD??Backplane Header, Open Module, 36 Circuits, Gold (Au) Selective 0.76關m (30關), Pin Length 6.25mm (.246) |
| 0749792503 |
421Kb/4P |
2.00mm (.079) Pitch 6-Row VHDM-HSD??Backplane Header, Open Module, 100 Circuits, Gold (Au) Selective 0.76關m (30關), Pin Length 4.25mm (.167) |
| 0876161001 |
239Kb/5P |
6.35mm (.250) Pitch, Power, 2.54mm (.100) Pitch, Signal, EXTreme PowerPlus??(SSI) MPS Receptacle, Through Hole, Right Angle, 0.76關m (30關) Gold (Au) Plating |
| 0877159913 |
371Kb/5P |
1.00mm (.039) Pitch, PCI Express* Connector, 164 Circuits, Nylon 4/6 Glass-filled, Black Housing, Copper Alloy, 0.76關m (30關) Gold (Au) Plating |
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