| Producent | Numer części | Arkusz danych | Szczegółowy opis |
Molex Electronics Ltd.
|
0850130074 |
278Kb/8P |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse, 0.6關m (24關) Selective Gold (Au), 48 Circuits, Lead free |
| 0877580416 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 4 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0873811218 |
126Kb/3P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.38關m (15關") Gold (Au) Plating, without Cap, with Locating Peg, 12 Circuits |
| 0780790002 |
820Kb/10P |
1.00mm (.039") Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.38關m (15關") Gold (Au) Plating |
| 0780790021 |
822Kb/10P |
1.00mm (.039") Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.076關m (3關") Gold (Au) Plating |
| 0872632893 |
367Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Bottom Entry, 0.38關m (15關") Gold (Au) Selective, 28 Circuits, with Pick-and-Place Cap |
| 0877583016 |
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 30 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0754921035 |
282Kb/6P |
1.85mm by 1.85mm (.073 by .073") Pitch 2-Pair GbX짰 Backplane Connector SystemPower Module, 4 Circuits, 1.27關m (50關") Gold (Au), Lead Free |
| 0791081006 |
304Kb/6P |
2.00mm (.079") Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row ThroughHole, 0.38關m (15關") Gold (Au) Selective Plating, 14 Circuits, Leadfree |
| 0877581816 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 18 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0877581217 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 12 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0780610001 |
373Kb/7P |
1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38關m (15關) Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins |
| 0850030531 |
82Kb/3P |
2.54mm (.100) Pitch DIN 41612 Header, Style C/2, Right Angle, Through Hole, 0.6關m (24關) Selective Gold (Au), 16 Circuits, Lead free |
| 0850030701 |
83Kb/3P |
2.54mm (.100) Pitch DIN 41612 Header, Style C/2, Right Angle, Through Hole, 1關m (40關) Selective Gold (Au), 48 Circuits, Lead free |
| 0757830121 |
9Mb/98P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application, 36 Circuit, 0.76關m (30關) Gold (Au), Retention Shell, Dual Key |
| 0877583417 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 34 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0877583617 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 36 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0877582616 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 26 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0757830120 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application, 36 Circuit, 0.76關m (30關) Gold (Au), Retention Shell, Right Key |
| 0873401423 |
276Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount (Very Low Profile), Top Entry, with Locating Pegs, 0.76關m (30u) Gold (Au) Plating, 14 Circuits |
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