| Producent | Numer części | Arkusz danych | Szczegółowy opis |
Molex Electronics Ltd.
|
0757830112 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application, 36 Circuit, 0.38關m (15關) Gold (Au), SMT Shell, Dual Key |
| 0877159102 |
337Kb/6P |
1.00mm (.039) Pitch, PCI Express* Connector, 64 Circuits, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.38關m (15關) Gold (Au) Plating |
| 0877582816 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 28 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0757830126 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application, 36 Circuit, 0.38關m (15關) Gold (Au), SMT Shell, Universal Key |
| 0749791001 |
421Kb/4P |
2.00mm (.079) Pitch 6-Row VHDM-HSD??Backplane Header, Open Module, 40 Circuits, Gold (Au) Selective 0.76關m (30關), Pin Length 4.75mm (.187) |
| 0780610052 |
373Kb/7P |
1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38關m (15關) Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins |
| 0850133196 |
172Kb/6P |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse, 1關m (40關) Selective Gold (Au), 48 Circuits, Lead free |
| 0850030062 |
84Kb/3P |
2.54mm (.100) Pitch DIN 41612 Header, Style C/2, Right Angle, Through Hole, 0.6關m (24關) Selective Gold (Au), 48 Circuits, Lead free |
| 0749791009 |
421Kb/4P |
2.00mm (.079) Pitch 6-Row VHDM-HSD??Backplane Header, Open Module, 40 Circuits, Gold (Au) Selective 1.27關m (50關), Pin Length 5.15mm (.203) |
| 0850030737 |
74Kb/3P |
2.54mm (.100") Pitch DIN 41612 C/3 Style Male Header, Right Angle, Through Hole, 0.80關m (32關") Selective Gold (Au) Plating, 30 Circuits |
| 0873812264 |
327Kb/6P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.38關m (15關") Gold (Au) Plating, with Cap, without Locating Pegs, 22 Circuits |
| 0791081055 |
304Kb/6P |
2.00mm (.079") Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row Through- Hole, 0.76關m (30關") Gold (Au) Selective Plating, 12 Circuits |
| 0877584816 |
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 48 Circuits, 0.38關m(15關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0877582416 |
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 24 Circuits, 0.38關m 15關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0877580216 |
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 2 Circuits, 0.38關m(15關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0757830129 |
1Mb/14P |
0.80mm (.031") Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application36 Circuit, 0.38關m (15關") Gold (Au), Through Hole Shell, Left Key |
| 0791081018 |
304Kb/6P |
2.00mm (.079") Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row ThroughHole, 0.38關m (15關") Gold (Au) Selective Plating, 38 Circuits, Leadfree |
| 0753310253 |
343Kb/6P |
1.85mm by 1.85mm (.073 by .073") Pitch 3-Pair GbX짰 Backplane Connector SystemPower Module, 6 Circuits, 1.27關m (50關") Gold (Au), Lead Free |
| 0877131006 |
351Kb/7P |
1.27mm (.050") Pitch Serial ATA Host Receptacle, Surface Mount, Vertical, StandardHeight, with 1.05mm (.041") Plastic Locating Peg, 0.76關m (30關") Gold (Au) Selective |
| 0877159302 |
629Kb/10P |
1.00mm (.039) Pitch, PCI Express* Connector, 164 Circuits, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.38關m (15關) Gold (Au) Plating |
Polish ▼ 
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Vietnamese
Indian
Mexican
British
New Zealand
