| Producent | Numer części | Arkusz danych | Szczegółowy opis |
Molex Electronics Ltd.
|
0872631093 |
367Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Bottom Entry, 0.38關m (15關) Gold (Au) Selective, 10 Circuits, with Pick-and-Place Cap |
| 0877581817 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 18 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0877156111 |
347Kb/6P |
1.00mm (.039) Pitch, PCI Express* Connector, 64 Circuits, Nylon 6/6 Glass-filled, White Housing, Phosphor Bronze, 0.25關m (10關) Gold (Au) Plating |
| 0877584617 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 46 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0850031782 |
82Kb/3P |
2.54mm (.100) Pitch DIN 41612 Header, Style C/2, Right Angle, Through Hole, 0.6關m (24關) Selective Gold (Au), 32 Circuits, Lead free |
| 0780610061 |
373Kb/7P |
1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.76關m (30關) Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins |
| 0877580417 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 4 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0757830128 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application, 36 Circuit, 0.76關m (30關) Gold (Au), SMT Shell, Universal Key |
| 0872630893 |
367Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Bottom Entry, 0.38關m (15關) Gold (Au) Selective, 8 Circuits, with Pick-and-Place Cap |
| 0877584016 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 40 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0757830119 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application, 36 Circuit, 0.76關m (30關) Gold (Au), Retention Shell, Left Key |
| 0877583217 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 32 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0780610002 |
373Kb/7P |
1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38關m (15關) Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins |
| 0791077330 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075") Tail Length, 0.05關m (2關") Gold (Au) Selective Plating, 12 Circuits |
| 0791077013 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.38關m (15關") Gold (Au) Selective Plating, 28 Circuits |
| 0757830131 |
1Mb/14P |
0.80mm (.031") Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application, 36 Circuit, 0.38關m (15關") Gold (Au), Through Hole Shell, Dual Key |
| 0757830135 |
1Mb/14P |
0.80mm (.031") Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application, 36 Circuit, 0.76關m (30關") Gold (Au), Through Hole Shell, Dual Key |
| 0756490504 |
224Kb/3P |
1.85mm by 1.85mm (.073" by .073") Pitch 3-Pair GbX짰 Backplane L-Series Connector System, Open Header, 40 Circuits, Gold (Au) 0.76關m (30關") |
| 0791077205 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075") Tail Length, 0.38關m (15關") Gold (Au) Selective Plating, 12 Circuits |
| 0791077057 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.76關m (30關") Gold (Au) Selective Plating, 16 Circuits |
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