| Producent | Numer części | Arkusz danych | Szczegółowy opis |
Molex Electronics Ltd.
|
0875520687 |
155Kb/4P |
1.27mm (.050) Pitch EBBI??50D Receptacle, Through Hole, Right Angle, with Beveled Metal Pins, 0.76關m (30關) Gold (Au) Selective Plating, 68 Circuits, Leadfree |
| 0791077024 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.38關m (15關) Gold (Au) Selective Plating, 50 Circuits |
| 0873812017 |
126Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.76關m (30關) Gold (Au) Plating, without Cap, with Locating Peg, 20 Circuits, Leadfree |
| 0876411011 |
264Kb/5P |
1.27mm (.050) Pitch SCA-2 Plug, Surface Mount, Right Angle, 80 Circuits, 0.76關m (30關) Gold (Au) Plating, with Metal Locating Pegs, Lead-free |
| 0791081071 |
304Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row Through-Hole, 0.76關m (30關) Gold (Au) Selective Plating, 44 Circuits, Leadfree |
| 0791077224 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.38關m (15關) Gold (Au) Selective Plating, 50 Circuits |
| 0791077134 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.05關m (2關) Gold (Au) Selective Plating, 20 Circuits |
| 0791081063 |
304Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row Through-Hole, 0.76關m (30關) Gold (Au) Selective Plating, 28 Circuits, Leadfree |
| 0753310233 |
341Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 3-Pair GbX짰 Backplane Connector System, Power Module, 6 Circuits, 1.27關m (50關) Gold (Au), Lead Free |
| 0756490505 |
295Kb/5P |
1.85mm by 1.85mm (.073 by .073) Pitch 3-Pair GbX짰 Backplane L-Series Connector System, Open Header, 40 Circuits, Gold (Au) 0.76關m (30關) |
| 0791077256 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.76關m (30關) Gold (Au) Selective Plating, 14 Circuits |
| 0757840146 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Vertical, Internal Application, 36 Circuit, 0.38關m (15關) Gold (Au), Through Hole 3.18 Shell, Right Key |
| 0791077257 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.76關m (30關) Gold (Au) Selective Plating, 16 Circuits |
| 0754650505 |
254Kb/3P |
1.85mm by 1.85mm (.073 by .073) Pitch 4 Pair GbX짰 Backplane L-Series Connector System, Open Header, 55 Circuits, Gold (Au) 0.76關m (30關) |
| 0850481782 |
144Kb/4P |
2.54mm (.100) Pitch DIN 41612/IEC 603-2 Mixed Layout Connector, Through Hole, Vertical, Female Style M, with 4 additional high current solder contacts, 42 Circuits |
| 0757840149 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Vertical, Internal Application, 36 Circuit, 0.76關m (30關) Gold (Au), Through Hole 3.18 Shell, Left Key |
| 0791077061 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.76關m (30關") Gold (Au) Selective Plating, 24 Circuits |
| 0791077066 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.76關m (30關") Gold (Au) Selective Plating, 34 Circuits |
| 0757830149 |
1Mb/14P |
0.80mm (.031") Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application, 36 Circuit, 0.76關m (30關") Gold (Au), Through Hole Shell, Left Key |
| 0873811800 |
327Kb/6P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 4.50mm (.177") Height, 0.38關m (15關") Gold (Au) Plating, with Cap,without Locating Peg |
Polish ▼ 
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Vietnamese
Indian
Mexican
British
New Zealand
