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ATR0797 Arkusz danych(PDF) 9 Page - ATMEL Corporation |
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ATR0797 Arkusz danych(HTML) 9 Page - ATMEL Corporation |
9 / 11 page 9 ATR0797 4665D–SIGE–08/04 Figure 10. Demo Test Board (Fully Assembled PCB) Figure 11. Recommended Package Footprint Remark: Heatslug must be soldered to GND. In order to avoid soldering problems, plugging of the vias under the heatslug is recom- mended. Only ground signal traces are allowed directly under the package. 3.0 0.25 1.25 0.74 0.4 φ0.33 via - Indicates metalization - vias connect pad to underlying ground plane all units are in mm 3.0 0.9 0.7 6.9 0.74 |
Podobny numer części - ATR0797 |
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Podobny opis - ATR0797 |
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