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APM2518N Arkusz danych(PDF) 10 Page - Sinopower Semiconductor Inc |
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APM2518N Arkusz danych(HTML) 10 Page - Sinopower Semiconductor Inc |
10 / 10 page www.sinopowersemi.com 10 APM2518NU ® Copyright ã Sinopower Semiconductor, Inc. Rev. A.4 - December, 2016 Table 2. Pb-free Process – Classification Temperatures (Tc) Package Thickness Volume mm 3 <350 Volume mm 3 350-2000 Volume mm 3 >2000 <1.6 mm 260 °C 260 °C 260 °C 1.6 mm – 2.5 mm 260 °C 250 °C 245 °C ³2.5 mm 250 °C 245 °C 245 °C Table 1. SnPb Eutectic Process – Classification Temperatures (Tc) Package Thickness Volume mm 3 <350 Volume mm 3 ³350 <2.5 mm 235 °C 220 °C ³2.5 mm 220 °C 220 °C Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-120 seconds Average ramp-up rate (Tsmax to TP) 3 °C/second max. 3 °C/second max. Liquidous temperature (TL) Time at liquidous (tL) 183 °C 60-150 seconds 217 °C 60-150 seconds Peak package body Temperature (Tp)* See Classification Temp in table 1 See Classification Temp in table 2 Time (tP)** within 5°C of the specified classification temperature (Tc) 20** seconds 30** seconds Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. * Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Classification Reflow Profiles Customer Service Sinopower Semiconductor, Inc. 5F, No. 6, Dusing 1St Rd., Hsinchu Science Park, Hsinchu, 30078, Taiwan TEL: 886-3-5635818 Fax: 886-3-5635080 Reliability Test Program Test item Method Description SOLDERABILITY JESD-22, B102 5 Sec, 245 °C HTRB JESD-22, A108 1000 Hrs, 80% of VDS max @ Tjmax HTGB JESD-22, A108 1000 Hrs, 100% of VGS max @ Tjmax PCT JESD-22, A102 168 Hrs, 100 %RH, 2atm, 121°C TCT JESD-22, A104 500 Cycles, -65 °C~150°C |
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