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AM652X Arkusz danych(PDF) 264 Page - Texas Instruments |
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AM652X Arkusz danych(HTML) 264 Page - Texas Instruments |
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264 / 277 page ![]() SPRSP08 DECOUPLING CAPS_06 _ _ Device VDDA_3P3_SDIO VDDA_1P8_SDIO VDDSHVn VDDSn MMCSD (1) (1) CAP_VDDA_1P8_SDIO CAP_VDDSHV_SDIO SDIO LDO VSS VSS 1.8V 264 AM6548, AM6528, AM6546 AM6526, AM6527 SPRSP08I – NOVEMBER 2017 – REVISED DECEMBER 2019 www.ti.com Submit Documentation Feedback Product Folder Links: AM6548 AM6528 AM6546 AM6526 AM6527 Applications, Implementation, and Layout Copyright © 2017–2019, Texas Instruments Incorporated Figure 7-10. VDDSHV6 or VDDSHV7 used as the MMCSD supply for fixed 1.8V IO (1) VDDSHVn and VDDSn, where n = 6 or 7. (2) VDDA_1P8_SDIO, CAP_VDDA_1P8_SDIO, CAP_VDDSHV_SDIO, and VDDA_3P3_SDIO must be connected to VSS, when SDIO_LDO is not used with either MMC0 or MMC1. 7.2.9 Thermal Solution Guidance The Thermal Design Guide for DSP and ARM Application Processors provides guidance for successful implementation of a thermal solution for system designs containing this device. This document provides background information on common terms and methods related to thermal solutions. TI only supports designs that follow system design guidelines contained in the application report. |
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