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STM32MP157C Arkusz danych(PDF) 239 Page - STMicroelectronics

Numer części STM32MP157C
Szczegółowy opis  Arm® dual Cortex®-A7 800 MHz Cortex®-M4 MPU, 3D GPU, TFT/DSI, 37 comm. interfaces, 29 timers, adv. analog, crypto
PDF  260 Pages
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Producent  STMICROELECTRONICS [STMicroelectronics]
Strona internetowa  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32MP157C Arkusz danych(HTML) 239 Page - STMicroelectronics

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STM32MP157C/F
Package information
254
7
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
7.1
TFBGA257 package information
This TFBGA is a 257 balls, 10x10 mm, 0.5/0.65 mm pitch, low profile fine pitch ball grid
array package
Figure 64. TFBGA257 - Outline
1. Drawing is not to scale.
2. The tolerance of position that controls the location of the pattern of balls with respect to datums A and B.
For each ball there is a cylindrical tolerance zone eee perpendicular to datum C and located on true
position with respect to datums A and B as defined by e. The axis perpendicular to datum C of each ball
must lie within this tolerance zone
B02Y_ME_V1
D
E
F1
e1
e2
F2
E2
E1
F1
e2
F2
D2
D1
K
H
D
A
B
C
E
F
G
J
L
M
N
P
R
U
T
V
W
A
B
1H
1D
1A
1B
1C
1E
1F
1G
1J
Peripheral ball matrix pitch 0.5 mm
Central ball matrix pitch 0.65 mm
1
2
3
4
5
6
7
8
9
10
11
12
15
13
14
16
17
18
19
1
2
3
4
5
6
7
8
9
A1 ball pad corner
b (257 balls)
eee M C A B
fff
M C
A
A1
A2
SEATING
PLANE
C
ddd C
BOTTOM VIEW
TOP VIEW
SIDE VIEW
e1



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