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STM32L072VB Arkusz danych(PDF) 150 Page - STMicroelectronics |
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STM32L072VB Arkusz danych(HTML) 150 Page - STMicroelectronics |
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150 / 160 page ![]() Package information STM32L072xx 150/160 DS10689 Rev 5 7.10 UFQFPN32 package information Figure 68. UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat package outline 1. Drawing is not to scale. 2. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this backside pad to PCB ground. A0B8_ME_V3 1 32 PIN 1 Identifier SEATINGPLANE C C ddd A A1 A3 e b D1 b E2 L e E1 E D2 L D |
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