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Zakładka z wyszukiwarką danych komponentów |
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Zakładka z wyszukiwarką danych komponentów |
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HC705P6AGRS/D Arkusz danych(PDF) 131 Page - NXP Semiconductors |
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HC705P6AGRS/D Arkusz danych(HTML) 131 Page - NXP Semiconductors |
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131 / 134 page  MC68HC705P6A — Rev. 1.0 General Release Specification Ordering Information General Release Specification — MC68HC705P6A Section 16. Ordering Information 16.1 Contents 16.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .131 16.3 MC Order Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .131 16.2 Introduction This section contains ordering information for the available package types. 16.3 MC Order Numbers The following table shows the MC order numbers for the available package types. MC Order Number Operating Temperature Range MC68HC705P6ACP (Extended) –40 °C to 85 °C MC68HC705P6ACDW (Extended) –40 °C to 85 °C NOTE: P = Plastic Dual In-Line Package DW = Small Outline Integrated Circuit (SOIC) Package Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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