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CST12.0MTWA Arkusz danych(PDF) 143 Page - STMicroelectronics |
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CST12.0MTWA Arkusz danych(HTML) 143 Page - STMicroelectronics |
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143 / 153 page ![]() ST72334J/N, ST72314J/N, ST72124J 143/153 17.2 SOLDERING AND GLUEABILITY INFORMATION Recommended soldering information given only as design guidelines in Figure 105 and Figure 106. Recommended glue for SMD plastic packages dedicated to molding compound with silicone: s Heraeus: PD945, PD955 s Loctite: 3615, 3298 Figure 105. Recommended Wave Soldering Profile (with 37% Sn and 63% Pb) Figure 106. Recommended Reflow Soldering Oven Profile (MID JEDEC) 250 200 150 100 50 0 40 80 120 160 Time [sec] Temp. [°C] 20 60 100 140 5 sec COOLING PHASE (ROOM TEMPERATURE) PREHEATING 80°C PHASE SOLDERING PHASE 250 200 150 100 50 0 100 200 300 400 Time [sec] Temp. [°C] ramp up 2°C/sec for 50sec 90 sec at 125°C 150 sec above 183°C ramp down natural 2°C/sec max Tmax=220+/-5°C for 25 sec |
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