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LM339BIDR Arkusz danych(PDF) 8 Page - Texas Instruments |
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LM339BIDR Arkusz danych(HTML) 8 Page - Texas Instruments |
8 / 48 page 7.7 Thermal Information for LM339B and LM2901B THERMAL METRIC(1) LM339B, LM2901B UNIT D (SOIC) PW (TSSOP) DDY (SOT-23) RUC (QFN) RTE (QFN) 14 PINS 14 PINS 14 PINS 14 PINS 16 PINS RθJA Junction-to-ambient thermal resistance 111.2 136.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 66.9 66.6 °C/W RθJB Junction-to-board thermal resistance 67.8 79.8 °C/W ψJT Junction-to-top characterization parameter 28.0 17.8 °C/W ψJB Junction-to-board characterization parameter 67.4 79.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance - - - °C/W (1) For more information about traditional and new thermal metrics, see the Semicondctor and IC Package Thermal Metrics report, SPRA953. 7.8 Thermal Information for Non-B Versions THERMAL METRIC(1) LMx39, LM2901x UNIT D (SOIC) DB (SSOP) N (PDIP) NS (SO) PW (TSSOP) J (CDIP) W (CFP) RθJA Junction-to-ambient thermal resistance 98.8 111.8 79 96.2 120 89.5 156.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 64.3 63.6 73.4 56.1 59 46.1 86.7 °C/W RθJB Junction-to-board thermal resistance 59.7 60.5 58.7 56.9 68.8 78.7 154.6 °C/W ψJT Junction-to-top characterization parameter 25.7 26.2 48.3 24.8 9.9 3 56.5 °C/W ψJB Junction-to-board characterization parameter 59.3 59.8 58.5 56.4 68.2 71.8 133.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — — — — 24.2 14.3 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. LM139, LM239, LM339, LM339B, LM139A, LM239A LM339A, LM2901B, LM2901, LM2901AV, LM2901V SLCS006V – OCTOBER 1979 – REVISED DECEMBER 2022 www.ti.com 8 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LM139 LM239 LM339 LM339B LM139A LM239A LM339A LM2901B LM2901 LM2901AV LM2901V |
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