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STM32F303VC Arkusz danych(PDF) 113 Page - STMicroelectronics

Numer części STM32F303VC
Szczegółowy opis  ARM Cortex-M4F 32b MCUFPU, up to 256KB Flash48KB SRAM
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STM32F302xx/STM32F303xx
Electrical characteristics
Doc ID 023353 Rev 5
113/133
Figure 34.
12-bit buffered /non-buffered DAC
1.
The DAC integrates an output buffer that can be used to reduce the output impedance and to drive external loads directly
without the use of an external operational amplifier. The buffer can be bypassed by configuring the BOFFx bit in the
DAC_CR register.
tSETTLING
(3)
Settling time (full scale: for a
10-bit input code transition
between the lowest and the
highest input codes when
DAC_OUT reaches final
value ±1LSB
-3
4
µs CLOAD ≤ 50 pF, RLOAD ≥ 5 kΩ
Update
rate(3)
Max frequency for a correct
DAC_OUT change when
small variation in the input
code (from code i to i+1LSB)
--
1
MS/s CLOAD ≤ 50 pF, RLOAD ≥ 5 kΩ
tWAKEUP
(3)
Wakeup time from off state
(Setting the ENx bit in the
DAC Control register)
-
6.5
10
µs
CLOAD ≤ 50 pF, RLOAD ≥ 5 kΩ
input code between lowest and
highest possible ones.
PSRR+ (1)
Power supply rejection ratio
(to VDDA) (static DC
measurement
-
–67
–40
dB No RLOAD, CLOAD = 50 pF
1.
Guaranteed by design, not tested in production.
2.
Quiescent mode refers to the state of the DAC a keeping steady value on the output, so no dynamic consumption is
involved.
3.
Data based on characterization results, not tested in production.
Table 70.
DAC characteristics (continued)
Symbol
Parameter
Min
Typ
Max
Unit
Comments
R LOAD
C LOAD
Buffered/Non-buffered DAC
DACx_OUT
Buffer(1)
12-bit
digital to
analog
converter
ai17157



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