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LM339DT Arkusz danych(PDF) 24 Page - Rohm

Numer części LM339DT
Szczegółowy opis  SIGNATURE SERIES Comparators
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LM339DT Arkusz danych(HTML) 24 Page - Rohm

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www.rohm.com
TSZ02201-0RFR0G200530-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
24/34
6.July.2015 Rev.001
TSZ22111・15・001
LM393xxx
LM2903xx
LM339xx
LM2901xx
Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable
temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and
consumable power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the
thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 51(a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the
Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (TJmax), and power dissipation
(PD).
θJA = (TJmax-TA) / PD
°C/W
The Derating curve in Figure 51(b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal
resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition,
wind velocity, etc. This may also vary even when the same package is used. Thermal reduction curve indicates a reference
value measured at a specified condition. Figure 51(c) and (d) shows an example of the derating curve for LM393xxx,
LM2903xx, LM339xx, and LM2901xx.
(Note 21)
(Note 22)
(Note 23)
(Note 24)
(Note 25)
Unit
5.4
5.0
4.7
8.2
6.8
mW/°C
When using the unit above TA=25°C, subtract the value above per Celsius degree.
Power dissipation is the value when FR4 glass epoxy board 70mm ×70mm ×1.6mm (cooper foil area below 3%) is mounted.
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0
25
50
75
100 125
150
Ambient Temperature [°C]
0.0
0.2
0.4
0.6
0.8
1.0
0
25
50
75
100 125 150
Ambient Temperature [°C]
Figure 51. Thermal Resistance and Derating Curve
(c) LM393xxx/LM2903xx
θJA=(TJmax-TA)/ PD °C/W
Ambient temperature TA [ °C ]
Chip surface temperature TJ [ °C ]
(a) Thermal Resistance
(b) Derating Curve
Ambient temperature TA [ °C ]
Power dissipation of LSI [W]
PDmax
θJA2 < θJA1
050
75
100
125
150
25
P1
P2
θJA2
θJA1
TJmax
(d) LM339xx/LM2901xx
85
LM393PT
(Note 22)
LM393WPT
(Note 22)
LM2903PT
(Note 22)
LM2903DT
(Note 21)
LM393DT
(Note 21)
LM393WDT
(Note 21)
LM393ST
(Note 23)
85
LM339DT
(Note 24)
LM339PT
(Note 25)
LM2901DT
(Note 24)
LM2901PT
(Note 25)


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