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LM339DT Arkusz danych(PDF) 24 Page - Rohm |
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LM339DT Arkusz danych(HTML) 24 Page - Rohm |
24 / 38 page Datasheet www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 24/34 6.July.2015 Rev.001 TSZ22111・15・001 LM393xxx LM2903xx LM339xx LM2901xx Power Dissipation Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and consumable power. Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance. Figure 51(a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (TJmax), and power dissipation (PD). θJA = (TJmax-TA) / PD °C/W The Derating curve in Figure 51(b) indicates the power that the IC can consume with reference to ambient temperature. Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc. This may also vary even when the same package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 51(c) and (d) shows an example of the derating curve for LM393xxx, LM2903xx, LM339xx, and LM2901xx. (Note 21) (Note 22) (Note 23) (Note 24) (Note 25) Unit 5.4 5.0 4.7 8.2 6.8 mW/°C When using the unit above TA=25°C, subtract the value above per Celsius degree. Power dissipation is the value when FR4 glass epoxy board 70mm ×70mm ×1.6mm (cooper foil area below 3%) is mounted. 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 25 50 75 100 125 150 Ambient Temperature [°C] 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 Ambient Temperature [°C] Figure 51. Thermal Resistance and Derating Curve (c) LM393xxx/LM2903xx θJA=(TJmax-TA)/ PD °C/W Ambient temperature TA [ °C ] Chip surface temperature TJ [ °C ] (a) Thermal Resistance (b) Derating Curve Ambient temperature TA [ °C ] Power dissipation of LSI [W] PDmax θJA2 < θJA1 050 75 100 125 150 25 P1 P2 θJA2 θJA1 TJmax (d) LM339xx/LM2901xx 85 LM393PT (Note 22) LM393WPT (Note 22) LM2903PT (Note 22) LM2903DT (Note 21) LM393DT (Note 21) LM393WDT (Note 21) LM393ST (Note 23) 85 LM339DT (Note 24) LM339PT (Note 25) LM2901DT (Note 24) LM2901PT (Note 25) |
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