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STM32F779IIY7 Arkusz danych(PDF) 243 Page - STMicroelectronics |
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STM32F779IIY7 Arkusz danych(HTML) 243 Page - STMicroelectronics |
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243 / 255 page ![]() DocID028294 Rev 4 243/255 STM32F777xx STM32F778Ax STM32F779xx Package information 254 Figure 96. WLCSP 180-bump, 5.5 x 6 mm, 0.4 mm pitch wafer level chip scale package recommended footprint 1. Dimensions are expressed in millimeters. Table 130. WLCSP 180-bump, 5.5 x 6 mm, recommended PCB design rules (0.4 mm pitch) Dimension Recommended values Pitch 0.4 Dpad 0.225 mm Dsm 0.290 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.1 mm |
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