Zakładka z wyszukiwarką danych komponentów
  Polish  ▼
ALLDATASHEET.PL

X  

  • ATS-04A-202-C2-R0

  • AI
    The **ATS-04A-202-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **push-pin** attachment series designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Property | Value / Description | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 15.00mm | | **Thermal Resistance** | 14.83 °C/W (@ 100 LFM) | | **Fin Style** | Straight (High-Flow) | | **Spring Type** | Compression Spring | --- ### 2. Key Components & Electronics Integration #### A. Thermal Interface Material (TIM) This model typically comes pre-applied with **T766** thermal phase change material. In electronics, this is critical because it fills the microscopic air gaps between the component (silicon die) and the heat sink base, significantly reducing thermal contact resistance. #### B. Push-Pin Mounting System The part uses a **Brass Push-Pin** with a compression spring. This is an "electronic-safe" mounting method that: * Provides consistent pressure across the chip to prevent cracking. * Ensures reliable thermal contact even during vibration or thermal expansion. * Uses a standard hole pattern (usually 47mm spacing for this size) on the PCB. #### C. Fin Geometry The fins are designed for **forced air cooling**. The spacing is optimized to minimize pressure drop while maximizing surface area. In an electronic chassis, this part works best when aligned with the airflow from a system fan. --- ### 3. Applications in Electronics This heat sink is commonly used in the following electronic systems: * **Networking Hardware:** High-speed routers and switches. * **Industrial PCs:** Compact motherboards requiring low-profile cooling (15mm height). * **Power Electronics:** Cooling MOSFET arrays or voltage regulator modules (VRMs). * **Embedded Systems:** High-performance ARM or FPGA modules. ---
    ✨ Follow-up Questions
    • What are the specific hole patterns required on a PCB for this push-pin heat sink?
    • How does blue anodization affect the thermal performance compared to bare aluminum?
    • Can the T766 thermal interface material be replaced with standard thermal paste?