ATS-04D-32-C1-R0
AI

The **ATS-04D-32-C1-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs.
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### 1. Key Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) with Brass Springs |
| **Thermal Resistance** | 21.45°C/W (at 100 LFM) to 3.20°C/W (at 600 LFM) |
| **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 15.00mm |
| **Thermal Interface (TIM)** | ATS-51 (Pre-applied phase change material) |
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### 2. Design Characteristics
This heatsink is part of the **push-pin** series, which is favored in industrial electronics for reliability and ease of assembly.
#### A. Fin Geometry
* **Fin Type:** Straight Fin.
* **Performance:** Optimized for "longitudinal" airflow, meaning it works best when air is forced through the channels between the fins.
#### B. Attachment Mechanism
* **Push-Pins:** These provide a secure, standardized mechanical connection to the PCB.
* **Springs:** The brass springs ensure constant "clamping force," which is critical for maintaining contact between the component and the heatsink, especially during vibration or thermal expansion.
#### C. Thermal Interface Material (TIM)
* The **C1** in the part number indicates it comes with **ATS-51**, a high-performance thermal pad. This eliminates the need for manual application of thermal grease during the manufacturing process.
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### 3. Application Use Cases
This specific part is typically found in:
* **Telecommunications:** High-speed routers and switches.
* **Embedded Computing:** Industrial PC modules.
* **Power Supplies:** Cooling voltage regulators or power MOSFETs.
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### 4. Thermal Performance Data
*Measured in °C/W (Lower is better)*
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 21.45 |
| 200 (1.0 m/s) | 11.75 |
| 400 (2.0 m/s) | 5.38 |
| 600 (3.0 m/s) | 3.20 |
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- ⤷
What are the PCB hole requirements for the push-pin mounting of this heatsink?
- ⤷ How does the ATS-51 thermal interface material compare to standard thermal paste?
- ⤷ Are there alternative fin designs available for this footprint to handle cross-flow air?