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  • ATS-04D-32-C1-R0

  • AI
    The **ATS-04D-32-C1-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Key Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) with Brass Springs | | **Thermal Resistance** | 21.45°C/W (at 100 LFM) to 3.20°C/W (at 600 LFM) | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 15.00mm | | **Thermal Interface (TIM)** | ATS-51 (Pre-applied phase change material) | --- ### 2. Design Characteristics This heatsink is part of the **push-pin** series, which is favored in industrial electronics for reliability and ease of assembly. #### A. Fin Geometry * **Fin Type:** Straight Fin. * **Performance:** Optimized for "longitudinal" airflow, meaning it works best when air is forced through the channels between the fins. #### B. Attachment Mechanism * **Push-Pins:** These provide a secure, standardized mechanical connection to the PCB. * **Springs:** The brass springs ensure constant "clamping force," which is critical for maintaining contact between the component and the heatsink, especially during vibration or thermal expansion. #### C. Thermal Interface Material (TIM) * The **C1** in the part number indicates it comes with **ATS-51**, a high-performance thermal pad. This eliminates the need for manual application of thermal grease during the manufacturing process. --- ### 3. Application Use Cases This specific part is typically found in: * **Telecommunications:** High-speed routers and switches. * **Embedded Computing:** Industrial PC modules. * **Power Supplies:** Cooling voltage regulators or power MOSFETs. --- ### 4. Thermal Performance Data *Measured in °C/W (Lower is better)* | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 21.45 | | 200 (1.0 m/s) | 11.75 | | 400 (2.0 m/s) | 5.38 | | 600 (3.0 m/s) | 3.20 | ---
    ✨ Follow-up Questions
    • What are the PCB hole requirements for the push-pin mounting of this heatsink?
    • How does the ATS-51 thermal interface material compare to standard thermal paste?
    • Are there alternative fin designs available for this footprint to handle cross-flow air?