The **ATS-06B-84-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). ### 1. General Specifications This part is designed for cooling electronic components such as CPUs, GPUs, or high-power transistors. It utilizes a "push-pin" attachment mechanism for secure mounting to a PCB. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Fin Type** | Straight Fin | | **Dimensions** | 30mm x 30mm x 25mm | | **Attachment** | Push-Pin (Brass) | --- ### 2. Thermal Performance The primary function of this part is to dissipate heat into the surrounding air. Its performance is measured by thermal resistance ($^\circ C/W$). Lower values indicate better cooling. * **Thermal Resistance (Unducted):** Approx. 7.00 $^\circ C/W$ at 100 LFM (Linear Feet per Minute). * **Thermal Resistance (Ducted):** Approx. 1.78 $^\circ C/W$ at 700 LFM. ### 3. Key Components & Materials 1. **Heat Sink Body:** Made of extruded aluminum (Al6063) for high thermal conductivity and low weight. 2. **Springs:** Stainless steel springs (typically AISI 302) provide consistent pressure to maintain contact with the chip. 3. **TIM (Thermal Interface Material):** Usually comes pre-applied with **T766** (a high-performance phase-change material) to fill microscopic air gaps between the component and the sink. 4. **Fasteners:** Brass push-pins designed for specific PCB hole patterns (typically 20mm spacing for this model). --- ### 4. Technical Drawing & Mounting The part follows a specific physical footprint to ensure compatibility with standard board layouts. ```markdown Dimension A (Length): 30.00 mm Dimension B (Width): 30.00 mm Dimension C (Height): 25.00 mm Dimension E (Pitch): 35.00 mm (Distance between pins) Dimension F (Pitch): 35.00 mm ``` ### 5. Application Use Cases * **Telecommunications:** Cooling of high-speed network switches. * **Industrial:** Thermal management for motor controllers. * **Computing:** Secondary cooling for chipsets or voltage regulator modules (VRMs).