The **ATS-07B-07-C1-R0** is a specific electronic cooling component produced by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for thermal management of surface-mount components such as CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink | | **Fin Style** | Push-Pin (Straight Fin) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin with Spring | | **Dimensions** | 45mm x 45mm x 12.7mm | | **Thermal Resistance** | 16.97°C/W (at 200 LFM) | --- ### 2. Breakdown of the Model Number The part number can be decoded to understand its specific configuration: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **07B**: Series designation (likely refers to the footprint/base size). * **07**: Specific variation or height code. * **C1**: Material and Thermal Interface Material (TIM) code. "C1" typically indicates the use of **T766** (a high-performance thermal pad or grease). * **R0**: RoHS compliance status (standard Lead-Free). --- ### 3. Key Electronic Components & Design While the heat sink itself is mechanical, its "electronic" utility is defined by its interaction with the PCB: #### A. Thermal Interface Material (TIM) The base of the ATS-07B-07-C1-R0 usually comes pre-applied with a thermal phase-change material. This fills the microscopic air gaps between the electronic chip and the aluminum base, significantly lowering thermal impedance. #### B. Push-Pin Attachment Instead of using adhesive tape (which can fail at high temperatures), this model uses a **spring-loaded push-pin** mechanism. * **Plastic Pins:** Insert into pre-drilled holes in the PCB. * **Compression Springs:** Provide consistent downward pressure on the electronic die, ensuring optimal contact. #### C. Fin Geometry The "Straight Fin" design is optimized for **forced-air cooling**. It is designed to work in environments where a system fan moves air across the fins to dissipate heat into the ambient environment. --- ### 4. Applications This part is commonly used to protect sensitive electronic components from thermal throttling or permanent damage in: * Network Switches and Routers. * Embedded computing boards. * Power supplies and industrial controllers.