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  • ATS-10B-101-C2-R0

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    The **ATS-10B-101-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **push-pin style heatsink** designed for cooling integrated circuits (ICs) such as CPUs, GPUs, or FPGAs on a Printed Circuit Board (PCB). Below is a detailed breakdown of its technical specifications and physical characteristics. ### 1. Component Overview | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Type** | Heatsink (Push-Pin Attachment) | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Interface Material (TIM)** | T766 (Pre-applied phase change material) | --- ### 2. Physical Dimensions The "101" in the part number corresponds to a specific size profile within the ATS "maxiFLOW" series. * **Size (L x W):** 45mm x 45mm * **Height:** 20mm * **Fin Style:** Straight fin design optimized for high-performance airflow. --- ### 3. Thermal Performance The efficiency of a heatsink is measured by its **Thermal Resistance** (°C/W). Lower values indicate better heat dissipation. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **Unducted (200 LFM)** | ~6.11 °C/W | | **Unducted (400 LFM)** | ~3.91 °C/W | | **Unducted (600 LFM)** | ~2.74 °C/W | --- ### 4. Mounting System (The "Push-Pin") The **C2-R0** suffix refers to the specific hardware used for attachment: * **Push-Pins:** These are brass or plastic spring-loaded pins that snap into pre-drilled holes in the PCB. * **Reliability:** The springs provide a consistent, calculated "clamping force" to ensure the heatsink maintains optimal contact with the chip, even during mechanical shock or vibration. * **Ease of Assembly:** Allows for tool-less installation on the production line. --- ### 5. Part Number Decoding (ATS-10B-101-C2-R0) | Code Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **10B** | maxiFLOW series with push-pin mounting | | **101** | Specific dimension profile (45x45x20mm) | | **C2** | Specific spring/pin material and tension configuration | | **R0** | RoHS compliant / standard revision | ---
    ✨ Follow-up Questions
    • What are the PCB hole diameter requirements for this specific push-pin model?
    • How does the T766 Thermal Interface Material compare to standard thermal grease?
    • Can this heatsink be used in passive (fanless) cooling environments?