ATS-10B-101-C2-R0
AI

The **ATS-10B-101-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **push-pin style heatsink** designed for cooling integrated circuits (ICs) such as CPUs, GPUs, or FPGAs on a Printed Circuit Board (PCB).
Below is a detailed breakdown of its technical specifications and physical characteristics.
### 1. Component Overview
| Property | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Product Type** | Heatsink (Push-Pin Attachment) |
| **Base Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied phase change material) |
---
### 2. Physical Dimensions
The "101" in the part number corresponds to a specific size profile within the ATS "maxiFLOW" series.
* **Size (L x W):** 45mm x 45mm
* **Height:** 20mm
* **Fin Style:** Straight fin design optimized for high-performance airflow.
---
### 3. Thermal Performance
The efficiency of a heatsink is measured by its **Thermal Resistance** (°C/W). Lower values indicate better heat dissipation.
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **Unducted (200 LFM)** | ~6.11 °C/W |
| **Unducted (400 LFM)** | ~3.91 °C/W |
| **Unducted (600 LFM)** | ~2.74 °C/W |
---
### 4. Mounting System (The "Push-Pin")
The **C2-R0** suffix refers to the specific hardware used for attachment:
* **Push-Pins:** These are brass or plastic spring-loaded pins that snap into pre-drilled holes in the PCB.
* **Reliability:** The springs provide a consistent, calculated "clamping force" to ensure the heatsink maintains optimal contact with the chip, even during mechanical shock or vibration.
* **Ease of Assembly:** Allows for tool-less installation on the production line.
---
### 5. Part Number Decoding (ATS-10B-101-C2-R0)
| Code Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **10B** | maxiFLOW series with push-pin mounting |
| **101** | Specific dimension profile (45x45x20mm) |
| **C2** | Specific spring/pin material and tension configuration |
| **R0** | RoHS compliant / standard revision |
---
- ⤷
What are the PCB hole diameter requirements for this specific push-pin model?
- ⤷ How does the T766 Thermal Interface Material compare to standard thermal grease?
- ⤷ Can this heatsink be used in passive (fanless) cooling environments?