The **ATS-10B-121-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance **Heat Sink** designed for cooling electronic components like CPUs, GPUs, and other integrated circuits. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Part Number** | ATS-10B-121-C3-R0 | | **Material** | Aluminum (Al6063) | | **Finish** | Blue Anodized | | **Heat Sink Type** | pushPIN™ HS Assembly | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 30.00mm | | **Attachment Method** | pushPIN™ (Plastic/Brass pins with springs) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Breakdown of the Model Number The part number follows a specific nomenclature used by ATS to describe the component's features: 1. **ATS-10B**: Part of the "pushPIN™" high-performance heat sink series. 2. **121**: Specific geometry and fin pattern (density and height). 3. **C3**: Indicates the material and finish (usually Blue Anodized Aluminum). 4. **R0**: Revision code or specific packaging/material variant. --- ### 3. Key Electronic Cooling Features * **Fin Design:** It utilizes a **Fine Pitch** fin pattern. This increases the surface area for heat dissipation, making it highly efficient for forced-air cooling (fan-driven airflow). * **Mounting System:** The **pushPIN™** system uses a compression spring and pin. This ensures consistent pressure between the heat sink and the electronic chip, which is critical for maximizing thermal transfer. * **Pre-applied TIM:** It comes with **T412 thermal interface material**, which eliminates the need for manual thermal paste application, reducing assembly time and ensuring a uniform layer. * **Thermal Performance:** It is designed for "High Flow" environments where air is moved rapidly across the fins to prevent the component from reaching its thermal throttling limit. --- ### 4. Typical Applications This component is found in various high-density electronic assemblies: * **Networking Hardware:** Switches, routers, and gateways. * **Embedded Systems:** Industrial PCs and automation controllers. * **Telecommunications:** Base stations and signal processing units.