The **ATS-10B-122-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 5.87°C/W (at 100 LFM) | | **Dimensions** | 45mm x 45mm x 15mm | | **Fin Pattern** | Fine Pitch (Cross-Cut) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to define the features of the heat sink: * **ATS-10**: Refers to the product line/series. * **B**: Denotes the revision or specific design variant. * **122**: Indicates the specific size and fin configuration. * **C2**: Refers to the **Thermal Interface Material (TIM)**. In this case, it usually implies the use of **T766** (a high-performance thermal pad or grease pre-applied). * **R0**: Indicates the version or packaging/compliance (RoHS compliant). --- ### 3. Key Electronic Functions While the heat sink itself is passive (it has no electrical circuits), it plays a critical role in the stability of an electronic system: 1. **Heat Dissipation:** It utilizes a **Cross-Cut fin design**, which allows for multi-directional airflow. This is crucial in dense electronic enclosures where airflow direction may vary. 2. **Thermal Interface:** The "C2" designation ensures that there is a high-quality thermal bond between the silicon die and the aluminum fins, minimizing the "Air Gap" resistance. 3. **Mechanical Mounting:** The **pushPIN™** system uses a compression spring. This provides precise pressure across the electronic chip, ensuring optimal thermal contact without cracking the delicate substrate of the component. --- ### 4. Typical Applications * **Embedded Systems:** For cooling SoCs (System on Chips). * **Telecommunications:** Used on high-speed networking line cards. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.