The **ATS-10B-125-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of the "push-pin" series designed for thermal management of electronic components such as CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Product Series** | pushPIN™ | | **Attachment Type** | Push-Pin (Plastic/Brass) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 10.00mm | | **Thermal Resistance** | 8.92 °C/W (at 100 LFM) | | **Fin Pattern** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Model Number The part number follows a specific nomenclature used by ATS to identify the configuration: - **ATS-10B**: Refers to the series and specific mechanical mounting layout. - **125**: Refers to the specific size/dimension configuration. - **C2**: Indicates the material and finish (Aluminum with a Blue Anodized coating). - **R0**: Refers to the revision and packaging status. --- ### 3. Key Electronic/Mechanical Features #### A. Push-Pin Mounting System This model uses a **push-pin** mechanism combined with a compression spring. This is critical for electronics because: - It ensures a consistent, high-pressure contact between the heat sink and the chip. - It reduces the risk of the heat sink shifting during vibration or shipping. - The pins are designed for 3.0mm holes in the PCB. #### B. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a phase-change material or high-performance grease that fills microscopic air gaps between the component and the heat sink, significantly improving heat transfer efficiency. #### C. Straight Fin Design The "Straight Fin" geometry is optimized for **forced air cooling**. In electronic enclosures where fans provide a steady airflow, the straight fins offer low resistance to air while maximizing the surface area available for dissipation. --- ### 4. Implementation Example If you were designing a PCB, you would use this component in the following manner: ```yaml Application: FPGA Cooling Mounting_Hole_Diameter: 3.0mm Pitch_Distance: 43.0mm (standard for this series) Airflow_Direction: Parallel to fins ```