The **ATS-10B-126-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits and power components. It is part of the "push pin" series manufactured by **Advanced Thermal Solutions (ATS)**. --- ### 1. Technical Specifications The following table summarizes the core electronic and physical characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Mounting Type** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring (Brass) | | **Thermal Resistance** | 5.47°C/W @ 100 LFM | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 15.00mm | | **Fin Style** | Straight Fin (Extrusion) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to define the product's attributes: - **ATS-10B**: Refers to the specific series (Standard Push-Pin Heatsink). - **126**: The unique identifier for the dimensions and fin geometry. - **C2**: Indicates the material/finish (typically refers to Blue Anodized Aluminum). - **R0**: Refers to the revision code or packaging standard. --- ### 3. Key Features and Applications #### Thermal Performance The heatsink is designed for "cross-flow" or "impingement" cooling. As air flows across the fins, the aluminum material conducts heat away from the semiconductor (CPU, GPU, or MOSFET) and dissipates it into the ambient air. #### Mounting System (Push-Pin) This part utilizes a **Push-Pin and Compression Spring** mechanism: 1. **Ease of Assembly:** Does not require specialized tools; pins are pushed into pre-drilled PCB holes. 2. **Constant Pressure:** The spring ensures uniform contact between the heatsink and the component, optimizing the thermal interface. 3. **Flexibility:** It can accommodate different PCB thicknesses depending on the pin length. #### Common Uses * **Networking Hardware:** Routers, switches, and gateways. * **Industrial PCs:** Cooling embedded processors. * **Power Supplies:** Heat dissipation for high-voltage regulators. --- ### 4. Critical Considerations When integrating this part into an electronic design, engineers must consider: * **Thermal Interface Material (TIM):** This part usually requires a thermal pad or grease (like Honeywell PCM or Shin-Etsu) to fill air gaps between the chip and the aluminum base. * **Airflow Direction:** Since this is a straight-fin design, it is most efficient when the airflow is parallel to the fins.