The **ATS-10B-13-C1-R0** is a specific part number for a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" series, designed primarily for cooling electronic components like BGA (Ball Grid Array) packages. --- ## 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is a breakdown of the technical data: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Extruded) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 13.68 °C/W (@ 100 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm | | **Attachment Method** | "pushPIN™" (Spring-loaded) | | **Hardware Included** | Compression Springs and Brass/Plastic Pins | --- ## 2. Key Components & Features ### A. The maxiFLOW™ Design Unlike standard square-fin heat sinks, the ATS-10B-13-C1-R0 features a **flared fin structure**. * **Purpose:** The tapered fins increase the surface area for radiant cooling and improve airflow efficiency. * **Benefit:** It reduces the "pressure drop," meaning air flows through the sink more easily, which is critical in tight electronic enclosures. ### B. The pushPIN™ Attachment System This is the "mechanical" part of the electronic assembly: * **Springs:** Provides a consistent "firm" pressure (clamping force) on the chip to ensure maximum thermal transfer. * **Interface Material:** These units typically come with a pre-applied **Thermal Interface Material (TIM)** or "Phase Change" pad on the bottom to fill microscopic gaps between the chip and the metal. ### C. Blue Anodized Finish * **Thermal Performance:** Anodizing isn't just for aesthetics; it increases the emissivity of the surface, allowing the metal to radiate heat more effectively. * **Protection:** It provides a non-conductive layer that protects the aluminum from corrosion. --- ## 3. Applications This part is commonly found in the following electronic systems: 1. **Telecommunications:** Cooling processors in routers and switches. 2. **Embedded Computing:** Industrial PC CPUs or high-end Microcontrollers. 3. **Power Electronics:** Cooling MOSFETs or power modules that generate significant heat in a small footprint. ---