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  • ATS-10B-69-C1-R0

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    The **ATS-10B-69-C1-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for cooling electronic components like CPUs, GPUs, or power modules. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-10B-69-C1-R0 | | **Component Type** | Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Thermal Resistance** | 11.49°C/W (at 100 LFM) | | **Flow Pattern** | Straight Fin | --- ### Breakdown of Electronic Characteristics #### 1. Thermal Management The primary "electronic" function of this part is **heat dissipation**. It prevents thermal throttling or permanent damage to semiconductors by transferring heat from the junction of the chip to the surrounding air. The straight-fin design is optimized for high-performance airflow. #### 2. pushPIN™ Attachment System This part uses a specialized mechanical attachment system designed for PCB (Printed Circuit Board) mounting: * **Compression Springs:** Provides precise pressure on the electronic component to ensure maximum thermal interface contact. * **Plastic/Brass Push Pins:** Allows for secure attachment through pre-drilled holes in the PCB without needing complex tools. #### 3. Material and Conductivity * **Aluminum Construction:** Offers a high thermal conductivity to weight ratio, ensuring the part does not add excessive mechanical stress to the PCB. * **Blue Anodization:** While decorative, the anodized layer provides a thin protective oxide coating that increases emissivity and provides basic surface insulation against electrical shorts. --- ### Component Identification Code The part number can be decoded as follows: * **ATS:** Advanced Thermal Solutions (Manufacturer) * **10B:** Product series/line * **69:** Specific model/fin configuration * **C1:** Thermal Interface Material (TIM) pre-applied (usually a high-performance phase-change material) * **R0:** Revision/RoHS compliance status
    ✨ Follow-up Questions
    • What is the significance of the C1 thermal interface material in this model?
    • How does the straight fin design compare to cross-cut fins for airflow?
    • What are the recommended PCB hole sizes for the pushPIN attachment?