The **ATS-14F-84-C1-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed by Advanced Thermal Solutions (ATS) as part of their "push pin" attachment series. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Component Type** | Passive Heat Sink | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 30mm x 30mm x 35mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Plastic) with Compression Spring | | **Thermal Resistance** | 6.96°C/W @ 100 LFM (Linear Feet per Minute) | | **Thermal Interface** | T766 Phase Change Material (Pre-applied) | --- ## 2. Key Features and Design ### Thermal Efficiency The high aspect ratio of the straight fins allows for efficient heat dissipation in systems with forced airflow. The **35mm height** provides a large surface area, making it suitable for high-power components in tight PCB layouts. ### Attachment Mechanism The "R0" suffix indicates the specific push-pin and spring assembly: * **Push-Pins:** Usually made of durable plastic or brass, designed to snap into pre-drilled holes (3mm) on the PCB. * **Compression Springs:** Ensure a consistent, high-pressure contact between the heatsink base and the electronic component, which minimizes thermal resistance. ### Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a phase-change material that softens at operating temperatures to fill microscopic air gaps between the heatsink and the chip, ensuring maximum heat transfer. --- ## 3. Common Applications This heatsink is typically found in the following electronic environments: * **Telecommunications:** Networking switches and routers. * **Embedded Systems:** High-speed processors and FPGAs. * **Power Supplies:** Cooling voltage regulators and power MOSFETs. * **Industrial PC:** Cooling chipsets on motherboards. ---