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  • ATS-14G-92-C2-R0

  • AI
    The part number **ATS-14G-92-C2-R0** refers to a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is specifically designed for cooling electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 15mm | | **Attachment Method** | push-PIN | | **Thermal Resistance** | 16.48°C/W (Unducted Flow) | | **Fin Style** | High-Performance Flat Fin | --- ### 2. Detailed Component Breakdown #### A. The "push-PIN" Mounting System This part utilizes a spring-loaded push-pin mechanism. This is critical for electronic stability because: * **Constant Pressure:** It ensures the heat sink maintains firm contact with the processor for maximum heat transfer. * **Pre-drilled Holes:** It requires specific holes in the Printed Circuit Board (PCB). * **Durability:** The brass or plastic pins with stainless steel springs provide a secure attachment that resists vibration. #### B. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** This is not just for aesthetics; anodizing increases the surface emissivity and protects the aluminum from corrosion. #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number usually signifies the inclusion of a high-performance **Phase Change Material (PCM)** or thermal pad pre-applied to the base. This eliminates the need for manual application of thermal paste. --- ### 3. Decoding the Part Number The part number follows a specific nomenclature used by ATS: ```text ATS - 14G - 92 - C2 - R0 | | | | | | | | | +-- Thermal Interface Material (Pre-applied) | | | +------- Color/Finish (C2 = Blue Anodized) | | +------------ Height Code (15mm) | +------------------ Series (push-PIN™ Heat Sink) +------------------------ Brand (Advanced Thermal Solutions) ``` --- ### 4. Performance Data (Airflow) Thermal performance is highly dependent on the velocity of the air provided by system fans: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 6.11 | | 400 (2.0 m/s) | 3.16 | | 600 (3.0 m/s) | 2.14 |
    ✨ Follow-up Questions
    • What are the PCB hole requirements for the push-PIN mounting system?
    • How does 'Blue Anodized' finish compare to 'Black Anodized' in terms of heat dissipation?
    • Can this heat sink be used for passive cooling without a fan?