ATS-14G-92-C2-R0
AI

The part number **ATS-14G-92-C2-R0** refers to a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is specifically designed for cooling electronic components like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
The following table summarizes the primary physical and thermal characteristics of this component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions** | 40mm x 40mm x 15mm |
| **Attachment Method** | push-PIN |
| **Thermal Resistance** | 16.48°C/W (Unducted Flow) |
| **Fin Style** | High-Performance Flat Fin |
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### 2. Detailed Component Breakdown
#### A. The "push-PIN" Mounting System
This part utilizes a spring-loaded push-pin mechanism. This is critical for electronic stability because:
* **Constant Pressure:** It ensures the heat sink maintains firm contact with the processor for maximum heat transfer.
* **Pre-drilled Holes:** It requires specific holes in the Printed Circuit Board (PCB).
* **Durability:** The brass or plastic pins with stainless steel springs provide a secure attachment that resists vibration.
#### B. Material and Coating
* **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio.
* **Blue Anodized Finish:** This is not just for aesthetics; anodizing increases the surface emissivity and protects the aluminum from corrosion.
#### C. Thermal Interface Material (TIM)
The "R0" at the end of the part number usually signifies the inclusion of a high-performance **Phase Change Material (PCM)** or thermal pad pre-applied to the base. This eliminates the need for manual application of thermal paste.
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### 3. Decoding the Part Number
The part number follows a specific nomenclature used by ATS:
```text
ATS - 14G - 92 - C2 - R0
| | | | |
| | | | +-- Thermal Interface Material (Pre-applied)
| | | +------- Color/Finish (C2 = Blue Anodized)
| | +------------ Height Code (15mm)
| +------------------ Series (push-PIN™ Heat Sink)
+------------------------ Brand (Advanced Thermal Solutions)
```
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### 4. Performance Data (Airflow)
Thermal performance is highly dependent on the velocity of the air provided by system fans:
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 200 (1.0 m/s) | 6.11 |
| 400 (2.0 m/s) | 3.16 |
| 600 (3.0 m/s) | 2.14 |
- ⤷
What are the PCB hole requirements for the push-PIN mounting system?
- ⤷ How does 'Blue Anodized' finish compare to 'Black Anodized' in terms of heat dissipation?
- ⤷ Can this heat sink be used for passive cooling without a fan?