ATS-19B-80-C1-R0
AI

The **ATS-19B-80-C1-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heat Sink** designed by Advanced Thermal Solutions (ATS) for cooling electronic components like CPUs, GPUs, and power modules.
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### 1. Technical Specifications
The part number follows a specific nomenclature used by ATS to define its physical and thermal characteristics.
| Feature | Specification | Description |
| :--- | :--- | :--- |
| **Type** | Heat Sink | Passive cooling component |
| **Material** | Aluminum | Lightweight with high thermal conductivity |
| **Attachment Method** | pushPIN™ | Spring-loaded plastic pins for secure mounting |
| **Dimension (L x W)** | 30mm x 30mm | Small form factor for dense PCB layouts |
| **Height** | 15mm | Low profile for height-restricted enclosures |
| **Thermal Resistance** | 18.99°C/W (Unducted) | Performance at natural convection |
| **Finish** | Blue Anodized | Protects against corrosion and improves aesthetics |
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### 2. Key Components & Parts
The "Electronic Parts" associated with this model are mechanical in nature but essential for electronic reliability:
* **Heat Sink Body:** A "straight-fin" design that provides a large surface area for heat dissipation into the surrounding air.
* **pushPIN™ Mounting:** This assembly includes a flexible spring and a plastic pin. It ensures "Constant Force" across the chip surface, preventing air gaps and improving thermal transfer.
* **Thermal Interface Material (TIM):** The "R0" suffix usually indicates that it comes with a pre-applied high-performance thermal pad or grease (specifically **ATS-54**), which fills microscopic air gaps between the component and the heat sink.
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### 3. Application Use Cases
This part is typically found in the following electronic environments:
1. **Telecommunications:** Cooling small chips on routers and switches.
2. **Embedded Systems:** Cooling microcontrollers or FPGAs on compact PCBs.
3. **Power Supplies:** Managing heat for voltage regulators or power transistors.
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### 4. Part Number Breakdown (ATS-19B-80-C1-R0)
| Segment | Meaning |
| :--- | :--- |
| **ATS-19** | Series/Product Family (pushPIN™) |
| **B** | Pin Type/Material Variant |
| **80** | Specific Fin Geometry/Size Reference |
| **C1** | Thermal Interface Material (TIM) code |
| **R0** | Revision or Packaging code |
- ⤷
What is the thermal conductivity of the ATS-54 interface material used in this part?
- ⤷ How do I calculate the airflow required to lower the thermal resistance of this heat sink?
- ⤷ Are there alternative mounting options if pushPIN™ is not compatible with my PCB?