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  • ATS-19B-80-C1-R0

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    The **ATS-19B-80-C1-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heat Sink** designed by Advanced Thermal Solutions (ATS) for cooling electronic components like CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define its physical and thermal characteristics. | Feature | Specification | Description | | :--- | :--- | :--- | | **Type** | Heat Sink | Passive cooling component | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Attachment Method** | pushPIN™ | Spring-loaded plastic pins for secure mounting | | **Dimension (L x W)** | 30mm x 30mm | Small form factor for dense PCB layouts | | **Height** | 15mm | Low profile for height-restricted enclosures | | **Thermal Resistance** | 18.99°C/W (Unducted) | Performance at natural convection | | **Finish** | Blue Anodized | Protects against corrosion and improves aesthetics | --- ### 2. Key Components & Parts The "Electronic Parts" associated with this model are mechanical in nature but essential for electronic reliability: * **Heat Sink Body:** A "straight-fin" design that provides a large surface area for heat dissipation into the surrounding air. * **pushPIN™ Mounting:** This assembly includes a flexible spring and a plastic pin. It ensures "Constant Force" across the chip surface, preventing air gaps and improving thermal transfer. * **Thermal Interface Material (TIM):** The "R0" suffix usually indicates that it comes with a pre-applied high-performance thermal pad or grease (specifically **ATS-54**), which fills microscopic air gaps between the component and the heat sink. --- ### 3. Application Use Cases This part is typically found in the following electronic environments: 1. **Telecommunications:** Cooling small chips on routers and switches. 2. **Embedded Systems:** Cooling microcontrollers or FPGAs on compact PCBs. 3. **Power Supplies:** Managing heat for voltage regulators or power transistors. --- ### 4. Part Number Breakdown (ATS-19B-80-C1-R0) | Segment | Meaning | | :--- | :--- | | **ATS-19** | Series/Product Family (pushPIN™) | | **B** | Pin Type/Material Variant | | **80** | Specific Fin Geometry/Size Reference | | **C1** | Thermal Interface Material (TIM) code | | **R0** | Revision or Packaging code |
    ✨ Follow-up Questions
    • What is the thermal conductivity of the ATS-54 interface material used in this part?
    • How do I calculate the airflow required to lower the thermal resistance of this heat sink?
    • Are there alternative mounting options if pushPIN™ is not compatible with my PCB?