The **ATS-52210P-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" product line, designed specifically for cooling electronic components like processors, FPGAs, and ASICs in high-airflow environments. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | push-PIN™ (Spring-loaded) | | **Thermal Resistance** | 2.50°C/W (at 200 LFM) | | **Overall Dimensions** | 52.00mm x 52.00mm | | **Height (Profile)** | 10.00mm | | **Base Surface** | Flat, for maximum contact area | --- ### 2. Design and Engineering Features * **maxiFLOW™ Geometry:** The heat sink features a tapered fin design. This geometry is engineered to maximize surface area for heat dissipation while minimizing the pressure drop as air passes through the fins. * **push-PIN™ Attachment:** The "-R0" designation refers to the mounting kit. It uses a secure, spring-loaded push-pin system. This ensures consistent pressure between the heat sink and the component, which is critical for efficient thermal transfer. * **High Performance:** Because of its low profile (10mm), it is ideal for space-constrained applications (like 1U servers or thin networking switches) where standard tall heat sinks will not fit. --- ### 3. Applications and Usage This part is typically found in the following electronic environments: 1. **Telecommunications:** Cooling high-speed data chips in routers and switches. 2. **Embedded Computing:** Protecting CPUs or GPUs in industrial motherboards. 3. **Power Supplies:** Managing heat for power-dense semiconductors. --- ### 4. Thermal Interface Material (TIM) The "C2" in the part number indicates that the heat sink typically comes with a pre-applied **Thermal Interface Material** (usually a high-performance phase-change material or thermal pad). This eliminates the need for manual thermal paste application during assembly, reducing the risk of air gaps.