The **ATS-52230P-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, which is specifically designed to provide high thermal performance in environments with constrained airflow. --- ### 1. Technical Specifications The following table highlights the critical mechanical and thermal properties of this component: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 52.00mm x 52.00mm x 23.00mm | | **Thermal Resistance** | 1.10° C/W (at 200 LFM) | | **Application** | BGA (Ball Grid Array) Cooling | --- ### 2. Key Design Features #### A. maxiFLOW™ Fin Geometry The "C2" in the part number indicates a specific fin pattern. Unlike traditional straight-fin heat sinks, maxiFLOW™ uses a **spread fin architecture**. This design increases the surface area and maximizes air turbulence, allowing for more efficient heat dissipation even at lower air velocities. #### B. pushPIN™ Attachment This model uses the **pushPIN™** mounting system. This is a significant electronic hardware feature because: * It ensures a **consistent pressure** across the component, optimizing the thermal interface material (TIM) performance. * It includes a built-in spring mechanism to prevent damage to delicate BGA components during installation or shipping. #### C. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Black Anodized Finish:** This is not just aesthetic; an anodized surface increases **emissivity**, which improves heat radiation, particularly in stagnant or low-airflow environments. --- ### 3. Application Use Cases This part is typically found in high-heat density electronic environments such as: * **Networking Equipment:** Routers, switches, and base stations. * **Embedded Systems:** Industrial PCs and high-performance controllers. * **Telecommunications:** High-speed data processing units. --- ### 4. Part Number Breakdown The nomenclature follows the ATS standard format: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **52230:** Dimensions (52mm x 52mm footprint, 23mm height). * **P:** pushPIN™ attachment type. * **C2:** Specific thermal performance/fin density category. * **R0:** RoHS compliant (Standard environmental certification).