The **ATS-55170D-C2-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for cooling electronic components like processors, FPGAs, and ASICs where space is limited but thermal demands are high. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Dimensions (L x W x H)** | 17mm x 17mm x 9.5mm | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Thermal Resistance** | 10.5 °C/W (at 200 LFM) | | **Fin Style** | Tapered Fin Design | --- ### 2. Key Electronic Features #### A. maxiFLOW™ Fin Geometry The part features a unique "flared" or tapered fin design. In electronics, this is critical because it reduces pressure drop and increases the surface area for heat dissipation. This allows the part to perform better in systems with restricted airflow compared to standard straight-fin heat sinks. #### B. maxiGRIP™ Attachment System Instead of using permanent thermal epoxy or drilling holes in the PCB, this part uses the **maxiGRIP™** system: * **Plastic Frame Clip:** A frame that snaps around the electronic component. * **Stainless Steel Spring Clip:** Applies steady, even pressure across the chip. * **Reusability:** Allows the heat sink to be removed for rework or testing without damaging the PCB or the chip. #### C. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes pre-assembled with a **Phase Change Material (PCM)** or high-performance thermal pad. This ensures there are no air gaps between the electronic chip (the heat source) and the aluminum heat sink. --- ### 3. Applications in Electronics This heat sink is specifically sized for small-form-factor high-power electronics, including: * **Networking:** Small routers, switches, and SFP modules. * **Telecommunications:** Optical line cards. * **Embedded Systems:** Industrial PCs and IoT gateways. * **Power Supplies:** Cooling MOSFETs or voltage regulators. ---