The **ATS-55210R-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their "maxiFLOW™" series, specifically designed for cooling electronic components such as processors, FPGAs, and ASICs. --- ### ## Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Series** | maxiFLOW™ | | **Dimensions (L x W x H)** | 21mm x 21mm x 14.5mm | | **Material** | Aluminum | | **Attachment Method** | thermalENTAD™ (maxiGRIP™ compatible) | | **Thermal Resistance** | 6.80 °C/W (at 200 LFM) | | **Finish** | Black Anodized | --- ### ### Key Electronic/Thermal Features 1. **maxiFLOW™ Design:** The heat sink features a high aspect ratio fin design. The spread-fin geometry maximizes surface area while maintaining a low pressure drop, which is critical for systems with dense airflow. 2. **Attachment Mechanism:** It typically utilizes the **maxiGRIP™** attachment system. This is a mechanical fastening method that uses a plastic frame clip and a stainless steel "X-clip." * **Advantage:** It provides high pressure for thermal interface materials without needing holes in the PCB. 3. **Thermal Interface Material (TIM):** The "R0" suffix usually indicates that the unit comes pre-applied with a high-performance thermal phase-change material or tape, ensuring efficient heat transfer from the electronic chip to the aluminum fins. 4. **Application Suitability:** Due to its small footprint (21x21mm), it is ideal for: * Network switches and routers. * Small Form-factor Pluggable (SFP) modules. * Localized cooling for voltage regulators. --- ### ### Performance vs. Airflow The efficiency of this part is highly dependent on the velocity of the air passing through it: * **@ 200 LFM (Linear Feet per Minute):** 6.8 °C/W * **@ 400 LFM:** 4.9 °C/W * **@ 600 LFM:** 4.1 °C/W ---