The **ATS-P2-149-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** product line, designed to provide efficient cooling for electronic components like processors, FPGAs, and ASICs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W)** | 35mm x 35mm | | **Height** | 20mm | | **Thermal Resistance** | 6.22°C/W (at 200 LFM) | | **Flow Pattern** | maxiFLOW™ (Tapered fin design) | --- ### 2. Key Electronic & Mechanical Components #### A. Fin Design (maxiFLOW™) Unlike standard straight-fin heat sinks, the ATS-P2-149-C2-R0 uses a **tapered fin** geometry. This design: * Increases the surface area for heat dissipation. * Reduces pressure drop, allowing air to flow more freely through the fins. * Optimizes cooling in environments with low-to-medium airflow. #### B. pushPIN™ Attachment System This heat sink uses a specialized mounting mechanism rather than simple adhesive. * **Springs:** Ensure constant, even pressure on the electronic chip to maximize thermal interface contact. * **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The "C2" in the part number typically refers to the thermal interface material provided. * **Pre-applied:** Usually comes with a high-performance thermal pad or phase-change material on the base. * **Purpose:** To eliminate air gaps between the chip surface and the aluminum base. --- ### 3. Application Use Cases This component is generally used in high-power electronic assemblies where heat must be moved away from sensitive silicon to prevent "thermal throttling" or hardware failure. * **Telecommunications:** Cooling high-speed networking chips. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Cooling MOSFETs or power regulators in a compact space. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (LFM - Linear Feet per Minute): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 10.47 | | 200 | 6.22 | | 300 | 4.90 | | 400 | 4.17 |