The **CM252016-R56M** is a surface-mount (SMD) wire-wound chip inductor commonly used in high-frequency circuits. Below is a detailed breakdown of its electronic specifications and characteristics. ### 1. Part Number Breakdown The part number follows a specific nomenclature used by manufacturers like **Bourns** or **TDK**: | Code | Meaning | Description | | :--- | :--- | :--- | | **CM** | Series Type | Chip Inductor (Wire-wound) | | **252016** | Case Size | Dimensions: 2.5mm x 2.0mm x 1.6mm (Metric) | | **R56** | Inductance Value | **0.56 µH** (R denotes decimal point) | | **M** | Tolerance | **±20%** | --- ### 2. Technical Specifications These components are designed for signal processing and power management in small devices. | Parameter | Value | | :--- | :--- | | **Inductance** | 0.56 µH | | **Tolerance** | ±20% | | **Test Frequency** | Typically 25.2 MHz | | **Self-Resonant Frequency (SRF)** | ~250 MHz - 450 MHz (Minimum) | | **DC Resistance (DCR)** | ~0.55 - 0.70 Ohms (Max) | | **Rated Current (Idc)** | ~300 mA - 450 mA | | **Operating Temperature** | -40°C to +125°C | --- ### 3. Physical Construction * **Core Material:** Usually Ferrite or Alumina Ceramic. Ferrite provides higher inductance and current handling, while Ceramic is used for higher frequency stability. * **Termination:** Tin-plated copper (lead-free/RoHS compliant) for easy soldering. * **Structure:** Wire-wound. A copper wire is wrapped around a core, offering a higher "Q" factor (quality factor) and lower DC resistance compared to multilayer inductors. --- ### 4. Key Applications Because of its small footprint and specific inductance, the CM252016-R56M is typically found in: 1. **RF Circuits:** Used for impedance matching and signal filtering in wireless communication modules. 2. **DC-DC Converters:** Acts as an energy storage element in low-power voltage regulators. 3. **EMI Suppression:** Filters out high-frequency noise in mobile phones, cameras, and GPS units. 4. **Audio/Video:** Decoupling and signal conditioning in portable electronics. --- ### 5. Soldering and Handling * **Mounting:** Designed for automated pick-and-place assembly. * **Reflow Profile:** Compatible with standard lead-free reflow profiles (J-STD-020). * **Moisture Sensitivity:** Generally rated at MSL 1 (unlimited floor life).