1. General Information

️· Device Type: Diode Doubler (MMIC - Monolithic Microwave Integrated Circuit)
️· Manufacturer: Marki Microwave
️· Operating Frequency Range (Input): 10 - 30 GHz
️· Output Frequency Range (2F): 20 - 60 GHz
️· Package Options: CH (die) and U (connectorized)
️· Datasheet Guarantee: Performance is guaranteed for connectorized (U) packages at T_A = +25°C. Die testing is sample-based.

2. Electrical Specifications (at T_A = +25°C, 50Ω system)

Parameter	Condition	Min	Typical	Max	Unit
Input Frequency Range		10		30	GHz
Output Frequency Range (2F)		20		60	GHz
Input Power		10		15	dBm
2F Conversion Loss (CL)	Input 10-30GHz, Output 20-60GHz	10.5	13	dB
Suppression (1F)	Input 10-30GHz, Output 10-30GHz	38		dBc
Suppression (3F)	Input 10-20GHz, Output 30-60GHz	39.5
Suppression (4F)	Input 10-15GHz, Output 40-60GHz	12.5
Isolation (1F)	Input 10-30GHz, Output 10-30GHz	49.7		dB
Isolation (3F)	Input 10-20GHz, Output 30-60GHz	50
Isolation (4F)	Input 10-15GHz, Output 40-60GHz	22.5

️· Harmonic Definitions:
- Suppression is defined as the harmonic power relative to the 2F doubled output power.
- Isolation is defined as the harmonic power relative to the 1F fundamental input power.

3. Mounting & Handling Recommendations

️· Mounting:
- Attach to a ground plane with conductive epoxy.
- Minimize epoxy fillet thickness.
️· Wire Bonding:
- Use 0.025mm (1 mil) pure gold wire.
- Thermosonic bonding: 150°C, ball bonding force 40-50g, wedge bonding 18-22g.
- Keep wire bonds as short as possible (<0.31 mm).
- Use multiple wire bonds for high-frequency connections to reduce parasitic inductance.
️· Circuit Considerations: Use 50Ω transmission lines.
️· Handling: Handle with tweezers or vacuum collet. Avoid direct human contact.
️· ESD Sensitivity: Sensitive to ESD (HBM, per MIL-STD-750, Method 1020). Handle in an ESD-protected environment.
️· Storage: Store in a dry nitrogen atmosphere.
️· Cleaning: Do not clean with liquid solvents.

4. Mechanical Data

️· CH Package (Die): Dimensions and bonding pad layout are described in the outline drawing.
️· U Package (Connectorized): Weight: 10g. Dimensions are outlined in the drawing.