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Numer części	SCSP

Szczegółowy opis	The Stacked CSP family leverages Amkor’s industry-leading ChipArray® Ball Grid Array (CABGA) manufacturing capabilities.

Rozmiar pliku	1197.61 Kbytes

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Producent	AMKOR [Amkor Technology]

Strona internetowa	http://www.amkor.com

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Podobny numer części - SCSP

Producent	Numer części	Arkusz danych	Szczegółowy opis
Amkor Technology	SCSP	411Kb / 2P	Silver Wirebonding 02/22
Semtech Corporation	SCSPF4L	67Kb / 2P	FAST RECOVERY HIGH CURRENT DOUBLER AND CENTER TAPS
	SCSPFF05L	71Kb / 2P	SUPERFAST HIGH CURRENT DOUBLER AND CENTER TAPS
	SCSPFF10L	71Kb / 2P	SUPERFAST HIGH CURRENT DOUBLER AND CENTER TAPS
	SCSPFF15L	71Kb / 2P	SUPERFAST HIGH CURRENT DOUBLER AND CENTER TAPS

Producent	Numer części	Arkusz danych	Szczegółowy opis
STATS ChipPAC, Ltd.	FBGA	559Kb / 2P	Fine Pitch Ball Grid Array
STATS ChipPAC, Ltd.	FBGA-SD	559Kb / 2P	Fine Pitch Ball Grid Array - Stacked Die
Agilent(Hewlett-Packard...	L4411A	249Kb / 7P	Leading the Industry in High-Performance System Test
Yamaichi Electronics Co...	IC264-22501-1	200Kb / 1P	Ball Grid Array (BGA, 1.50mm Pitch)
	IC280-169-127	263Kb / 5P	Ball Grid Array (FBGA / CSP / LGA)
	NP276-11904	738Kb / 11P	Ball Grid Array (BGA, 1.27mm Pitch)
	NP396-500	120Kb / 1P	Shrink Ball Grid Array (1.27mm Pitch)
KOA Speer Electronics, ...	BR	370Kb / 2P	ball grid array (bga) resistor networks
Abracon Corporation	ASCSM	1Mb / 3P	Ball Grid Array Packaging 04.24.14
MKS Instruments.	628E	262Kb / 4P	Industry-leading accuracy and repeatability