DESCRIPTION
The UPA809TF contains two NE688 NPN high frequency silicon bipolar chips. NECs new low profile TF package is ideal for all portable wireless applicatons where reducing component height is a prime consideration. Each transistor chip is independently mounted and easily configured for two stage cascade LNAs and other similar applications.

FEATURES
• SMALL PACKAGE OUTLINE:
    SOT-363 package measures just 2 mm x 1.25 mm
• LOW HEIGHT PROFILE:
    Just 0.60 mm high
• HIGH COLLECTOR CURRENT:
    IC MAX = 100 mA