FEATURES
·Guard -Ring for Stress Protection
·Low Forward Voltage
·High Operating Junction Temperature
·Guaranteed Reverse Avalanche
·Low Power Loss/High Efficiency
·High surge capability
·Low Stored Charge Majority Carrier Conduction
·Minimum Lot-to-Lot variations for robust device
performance and reliable operation

MECHANICAL CHARACTERISTICS
·Case: Epoxy, Molded
·Finish: All External Surfaces Corrosion Resistant and
Terminal Leads are Readily Solderable
·Lead Temperature for Soldering Purposes: 260℃ Max.
for 10 Seconds