Features
 Advanced Trench Process Technology
 Low Gate Charge
 Low reverse transfer capacitance
 Lead free in compliance with EU RoHS 2.0
 Green molding compound as per IEC 61249 standard
Mechanical Data
 Case: SOP-8 Package
 Terminals: Solderable per MIL-STD-750, Method 2026
 Approx. Weight: 0.0029 ounces, 0.083 grams