DESCRIPTION
This device has been designed to meet the increasing
demand for AlInGaP technology.
It consists of a lead frame which is embedded in a white
thermoplast. The reflector inside this package is filled up
with clear epoxy.
LED is mounted top down and emits through the PCB.

FEATURES
• SMD LED with exceptional brightness
• Luminous intensity categorized
• Compatible with automatic placement
equipment
• EIA and ICE standard package
• Compatible with IR reflow, vapor phase
and wave solder processes according to
CECC 00802 and J-STD-020C
• Available in 12 mm tape
• Low profile package
• Non-diffused lens: excellent for coupling to light pipes and
backlighting
• Low power consumption
• Luminous intensity ratio in one packaging unit
IVmax./IVmin. > 1.6
• Preconditioning according to JEDEC® level 2
• ESD-withstand voltage: up to 2 kV according to
JESD22-A114-B
• AEC-Q101 qualified
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912