The MBR2535CTG/45CTG series uses the Schottky Barrier
principle with a platinum barrier metal. These state−of−the−art
devices have the following features:
Features
 Guardring for Stress Protection
 Low Forward Voltage
 175C Operating Junction Temperature
 These are Pb−Free Devices*
Mechanical Characteristics
 Case: Epoxy, Molded
 Epoxy Meets UL 94 V−0 @ 0.125 in
 Weight: 1.9 Grams (Approximately)
 Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
 Lead Temperature for Soldering Purposes:
260C Max. for 10 Seconds
*For additional information on our Pb−Free strategy and soldering details, please
download the onsemi Soldering and Mounting Techniques Reference Manual,
SOLDERRM/D.